|
Ihr Zugang zu nationalen und |
|
| Profil Titel | Wafer-level glass hermetic packaging for optical MEMS and MEMS sensors |  |
Referenz | 09 CH 84FD 3EUN | |
| Herkunftsland | Switzerland | |
| Kooperationsart | Angebot | |
| Eintrag/Änderung | 2009-09-08 / 2009-09-08 |
Kurzfassung
This Swiss company is providing a wafer-level glass hermetic packaging technology. The packaging key characteristics are: ability to process wafer with free-standing MEMS structures, highly flexible cavity size and ability to overcome wafer with film topology (up to few micrometers). Transparent glass window can be coated with double side anti-reflective film. The technology is suitable for vacuum packaging. The company is open to license, manufacturing or commercial agreements.Details
MEMS (Micro-Electro-Mechanical System) packaging is mandatory for volume manufacturing. In order to strongly decrease the packaging cost and increasing the production yield, wafer-level packaging is required to protect all devices on one substrate (typically silicon or glass), at the same time.Hermetic package is mandatory to avoid humidity and dust that degrades the MEMS performances over time. Hermetic package ensures long device reliability.
The proposed packaging, initially developed for optical MEMS device but extendable to other MEMS, can be applied on a full wafer. It is compatible with wafer where bulk micromachining and through-wafer etching (opening on both sides of the wafer) were previously done
The fabrication process is highly flexible and various capping dimensions are possible, from few hundreds of micrometers to few millimetres.
The packaging technology allows to protect wafers with high topology (including conductive metal line crossing the packaging), up to few micrometers in thickness.
For optical MEMS, the company provides glass packaging with anti-reflective coating to maximize light transmission.
The company’s unique know-how and expertise includes packaging design rules, packaging technology and anti-reflective coating technology. The packaging solution can be extended to other silicon or glass MEMS devices, including sensors or actuators. The proposed packaging technology is suitable for vacuum encapsulation.
Innovative Aspects:
- Hermetic glass wafer-level packaging
- Packaging on free-standing structure
- Packaging on wafer with high topology
- Packaging suitable for vacuum encapsulation
- Double side capping possible
- Glass packaging with anti-reflective coating
- Low cost packaging solution.
Technologiesektor | - Elektronische Schaltkreise, Komponenten und Bauteile - Nanotechnologien - Verpackung für Materialien - Optik - Mikro- und Nanotechnologie |
Anwendungsbereich | - Scanning Related - Display panels - Semiconductor fabrication equipment and wafer products - Analytical and Scientific Instrumentation - Coatings and adhesives manufactures |
Entwicklungstand | Already on the market |
Patentrechte (IPR) | Exclusive rights |
Kooperationstyp | - License Agreement - Adaptation to specific needs - Transfer of knowledge in new raw materials - Assembly -Type of partner sought Industry and academics -Specific area of activity of the partner sensors and actuators on wafer -Task to be performed Give technical specification in terms of dimensions and materials used in the MEMS device, possibly acquire a license |
Organisationstyp | Industry Größe: < 10 |
| Status | Dieses Profil ist abgelaufen! Falls Sie denoch Interesse haben, kontaktieren Sie uns. |
Möchten Sie mit dieser Firma in Kontakt treten? Ja |
|